Job Openings in Grace Semiconductor Manufacturing Corporation

Grace Semiconductor Manufacturing Corporation (GSMC) is one of the largest semiconductor foundries in China. We are expanding our manufacturing capacity for a new 8" fab with technologies down to 0.13um. We are seeking self-motivated and experienced equipment and process engineers for this exciting startup in/near Shanghai, China.

We will have a booth in the CASPA Job Fair on April 19, 2008 at the Crowne Plaza in Milpitas. If you have 5 years of hands-on experience with manufacturing process tools (Furnace, Implant, Wet Benches, Litho, Dry Etch, CVD, PVD, etc.), good communication skills, and an integrative personality with high personal commitment, you will find that the best and exciting career with competitive expatriate package including housing, international health insurance and home trips is awaiting you.

Please submit your Resume by e-mail to Recruiting_02@gsmcthw.com and/or visit our booth at the CASPA job fair. We will be conducting on-site interviews at the job-fair.

   

Director of Fab Operations

Location: Shanghai

 

Job Description:

The Director of Fab Operations, reporting to the COO, will provide factory leadership and daily management for Grace¡¯s high-volume, dynamic, and state-of-the-art 200mm IC manufacturing. This senior level executive will be responsible for all manufacturing activities and resources and for leading all fab functions to ensure on-time delivery and quality assurance. This will require continuous improvement of operation efficiency and driving cost down. This professional is expected to bring a wide range of manufacturing excellence skills and deploy them to achieve our business goals.

 

Primary Responsibilities:

?           Provide factory leadership and management for proactive planning and execution of the production ramp, resource management, and tool and labor productivity improvements. 

?           Lead and coordinate teams to develop inventive fab strategies and systems to improve execution and efficiency in a high-volume manufacturing environment.

?           Oversee demand forecasting, procurement, WIP

?           Develop and implement processes and procedures to reduce cost, improve quality, and increase production

?           Set up dynamic factory work flow systems

?           Establish training/qualification systems

?           Manage fab operations budget

?           Develop modern PMS system to optimize factory performance

?           Drive uptime/operating costs for key process steps

?           Drive improvements to yield/module efficiency/throughput

?           Use MES system to drive performance

 

Qualifications:

?           10+ years of increasingly responsible operations roles

?           Demonstrated skills and previous experience in scaling up new technologies and building an operating team from very early stages

?           At least one assignment as Director of Operations in semiconductor manufacturing

?           Expert in many of the following (lean manufacturing, SPC, Six Sigma, Kan Ban, Kaizen)

?           Experience with ERP/MES systems

?           Candidate must have demonstrated leadership in influencing cross-factory teams, excellent communication skills

 

Department Manager (DF, ET, PH, TH, PIE)

-      Must possess a Masters in Engineering
-      Must have 8+ years experience in the related field

-      Demonstrates leadership in influencing cross-factory teams, excellent communication skills (fluent in both English and Mandarin) and an understanding of factory/fabrication operations

-      Experience in transfer, start up, and ramp of a high volume manufacturing facility, preferably running 200mm processes

-      Extensive experience in performance management practices and is able to apply those toward development of first line managers and direct reports

-      Working knowledge of technical development, as well as demonstrated experience establishing and maintaining successful relationships with partner organizations, internal and external, to drive aggressive roadmaps

-      Demonstrates passion towards innovation and risk-taking in order to achieve excellence

IT Department Manager of MES System

-           Bachelors or advanced degree in CS related field

-           8+ years of IT infrastructure management experience

-           3 years experience in managing 7-24 Fab MES system

-           Familiar with UNIX and Oracle database architecture

-           Possesses in-depth knowledge of SAP

-           Extensive experience in office automation

IT CIM Manager

-           Bachelors or advanced degree in CS related field

-           4+ years experience in management position

-           Ability to response/provide solutions to achieve zero-interruption-to-production

-           In-depth understanding of ITIL principle

-           Extensive knowledge of manufacturing process and MES technology

-           Comprehensive knowledge of PC, and UNIX server platforms

IT ITI Manager

-           Bachelors or advanced degree in CS or related field

-           4+ years experience in management position

-           In-depth knowledge in UNIX, PC and Oracle database

-           Extensive experience in project management, planning, ITIL methodology

-           Excellent communication skills with customers and suppliers

Mask-Making (DSD)

-           Masters or advanced degree in Electronics, EE, or related fields

-           3+ years experience in Semiconductor industry

-           Experience with Device Modeling extraction

Mixed Signal and Analog Characterization (DSD)

-           Masters or advanced degree in Electronics, EE, or related fields

-           3+ years experience in Semiconductor industry

-           Experience with Device Modeling extraction

IP Design Service (DSD)

-           Masters or advanced degree in EE

-           5+ years experience in Circuit Design related field

-           Involve Analog (A/D, D/A, PLL) circuit design

-           Involve RF device modeling and circuit design

-      Familiar with IP organization or CAD design tools: Verilog-XL, Synopsys, Avant!/Cadence P&R tools and HSPICE, Star-Sim, Timemill/Powermill Circuit Simulator

Layout (DSD)

-           Bachelors or advanced degree

-           Familiar with: Virtuso or Leo/Laker Layout Editor

-           Familiar with DRC/LVS/LPE Command File Development

-           Familiar with DRC/LVS tool operation: Cadence Dracula or Mentor Calibre

Analog Design (DSD)

-           Bachelors in EE

-           2+ years of Analog Circuit Design experience

-           Familiar with Cadence Design Environment (Composer / Virtuoso)

-           Familiar with Calibre, Hercules, Dracula, Assura Physical Verification tool

-           Familiar with IC design environment & flow.

-           Excellent Mandarin and English oral/written skills

-           Excellent interpersonal communication and teamwork skills

Memory Product (MTD)

-           Masters or advanced degree in EE

-           5+ years experience in Product, Design Engineering

-           Experience with Process Integration

  Front-End Integration (LTD)

-      Masters or advanced degree in EE

-      4+ years of hands-on Process Integration experience in logic, PLD or Flash Memory Technology Development, Test Chip Design, Design Rule Generation, Process Module Development and foundry interface

-      Experience with State Physics or Material Science and a CMOS Process and Material Property background

-      Excellent leadership skills and ability to work with other departments is required

-      Working experience in Front-End Process Integration is desired

-      Knowledge in Device Physics and Process Simulation is a plus

 

Back-End Integration (LTD)

-      Masters or advanced degree in EE

-      Exceptional background in State Physics or Material Science as well as experience with CMOS Process and Material Property

-      2+ years of hands-on experience in CMOS Far Back-End Process Integration (i.e. Electrical Fuse Development, Thick Metal, Pad Design and Packaging) 

-      Excellent teamwork skills and ability to work with other departments is required

-      Knowledge in Device Physics and Process Simulation is a plus

 

Front-End Integration (LTD)

-      Masters or advanced degree in EE

-      Exceptional background in State Physics as well as CMOS Process and Material Property

-      2+ years of hands-on Process Integration experience in CMOS 0.13um, 90nm or 65nm Front-End

Process Integration

-           Excellent teamwork skills and ability to work with other departments is required

-           Familiar with Device Physics and Process and Device Simulation tools

 

Yield Enhancements Supporting (PED, PIE)

-           Masters or advanced degree in EE

-           5+ years experience in Product, Failure Analysis and Statistics, Analysis Engineering

 

Memory Design (PED)

-           Bachelors in EE

-           3+ years experience in related field

-           Familiar with Cadence Design Environment (Composer / Virtuoso)

-           Familiar with Calibre, Hercules, Dracula, Assura physical verification tool

-           Memory and IP testing experience preferred

-           Familiar with IC design environment & flow

-           Excellent Mandarin and English oral/written skills

-           Excellent interpersonal communication and teamwork skills

 

Transistor Section Integration (PED)

-      Masters of advanced degree in EE

-      Proficient background in State Physics or Material Science as well as CMOS Process and Material Property

-      4+ years of hands-on experience in Process Integration in logic, PLD or Flash Memory Technology Development, Test Chip Design, Design Rule Generation, Process Module Development and Foundry interface

-      Excellent leadership skills and ability to work with other departments is required

-      Experience in Process Integration of Transistor Section is preferred

-      Knowledge in Device Physics and Process Simulation is a plus

Device Engineering (DTD)

-       Masters in EE

-      Proficient background in State Physics as well as experience with Semiconductor Device Physics and COMS process

-      5+ years of hands-on Semiconductor Industrial experience in logic, PLD or Flash Memory Technology Development, Device Characterization, Device Simulation, Test Chip Design and Electrical Design Rule Generation

-           Knowledge and experience in Device and Technology Reliability is a plus

-           Experience in leading technical projects and managing engineering groups is preferred

SPICE Modeling (DTD)

-           Masters in EE preferred

-           5+ years experience in Device Modeling (including BSIM4)

-           RF Modeling experience a plus

-           Excellent Mandarin and English oral/written skills

Device Design (DTD)

-           Masters in EE preferred

-           5+ years experience in Device Engineering

-           Familiar with Design of Experiment (DOE)

-           Excellent data analysis skills

-           Knowledge in Process Integration and/or TCAD Simulation a plus

-           Excellent Mandarin and English oral/written skills

-           Excellent interpersonal communication and management skills

OPC (AMTD)

-           Masters or advanced degree in EE, Optical

-           3+ years experience in OPC related field

-           Familiar with Synopsys or Mentor OPC (under 0.18 um and below) tools

-           Litho background is a plus

AMTD (CMP & Diffusion)

-           Bachelors or advance degree

-           7+ years experience in Semiconductor Industry

-           Ability to coordinate and manage

-           Fluent in English (oral/written)

AMTD (TF, CMP)

-           Bachelors in Material/Chemical/Physics Engineering or related field

-           5+ years experience in Semiconductor Industry.

-           Ability to coordinate and manage

-           Fluent in English (oral/written)

Customer Satisfaction

-       Bachelors relevant to Science/Engineering

-       8+ years experience in Semiconductor Industry

-       Strong background in customer quality control and audit in the Semiconductor Industry

 

-       Must have knowledge in TS16949 elements, particularly, SPC, APQA, and FMEA.

-      Previous experience in Fab process integration would be a plus.

-      Strong communication and people skills are required.

Failure Analysis

-      Bachelors or advanced degree in Science/Engineering

-      5+ years experience in related field

-      Must have hands-on experience in SEM, FIB, TEM, and related sample preparation and analysis tools

-      Previous experience in semiconductor industry would be a plus

Process Reliability and Qualification

-       Masters or advanced degree in EE

-      5+ years experience in the Device Reliability Qualification and Monitoring in the Semiconductor Industry

-      Must demonstrate experience and knowledge in Device Reliability Physics and Testing Methodology.

 


GRACE SEMICONDUCTOR MANUFACTURING CORPORATION COPYRIGHT 2008 ALL RIGHTS RESERVED